TP-108 Series
TP-108 Low Profile Test Point
The TP-108 low profile test point is the smallest in Components Corporation's complete line of printed circuit test points, engineered for advanced surface mount PCB applications where board real estate and vertical clearance are at a premium. Its footprint is comparable to a 1206 chip capacitor, and its ultra-compact profile makes it well suited for densely populated boards where conventional posts or turrets simply will not fit.
Whether your application is consumer electronics, aerospace, medical devices, or industrial electronics, the TP-108 delivers dependable probe access in a package that works with your layout.
The TP-108's loop configuration is central to its design advantage. Unlike posts and turrets, which require sharp probe tips that can slip under lateral force or puncture protective board coatings, the loop accepts most commercially available spring clips, j-hooks, and probes and holds them securely in place. This translates to faster, safer testing and eliminates the risk of damage to the board or injury to the operator that sharp probe tips introduce.
Materials and Finish
The TP-108 is manufactured from tempered Phosphor Bronze #510 Alloy flat wire using a proprietary process that yields long service life and consistent mechanical performance. The flat wire construction provides a greater surface area for mounting than round wire alternatives, which matters when accounting for the mechanical stresses introduced during repeated probe insertions over the life of a board.
As a mini surface mount test point, the TP-108 ships in two finish options. The standard version carries a 0.0001" minimum matte tin finish over a 0.0001" nickel underplate and is fully compatible with the reflow soldering process. For applications demanding lower contact resistance and greater oxidation resistance over time, the TP-108 is also available in silver plating: 0.0001" minimum silver over 0.00005" minimum copper.
Tape and Reel Packaging
The TP-108 is packaged in tape and reel format for direct use with automatic pick-and-place assembly systems. The 8mm wide, 4mm pitch black conductive polycarbonate carrier conforms to the ANSI/EIA-481 standard, making the TP-108 compatible with standard SMT production lines without any special handling requirements. Two reel sizes accommodate production volumes ranging from prototype runs to high-volume manufacturing.
Industries Served
The TP-108 is field-proven across a wide range of applications. It's used in medical devices, aerospace, consumer electronics, security electronics, and industrial electronics — anywhere that compact, reliable test access is required on a densely populated surface mount board.
Compliance
All TP-108 Series test points are manufactured in compliance with Directive 2015/863/EU RoHS and EU Regulation EC 1907/2006 (REACH), covering raw materials, component parts, and processes. The TP-108 can be confidently specified for regulated applications in medical, aerospace, and other mission-critical industries.
Certificate of Compliance with Directive 2015/863/EU RoHS and EU Regulation EC 1907/2006
Specifications
For complete dimensional drawings, pad size, and material details, download the TP-108 datasheet.
Work With a Manufacturer Built on a "No Failure" Credo
Components Corporation has built its reputation on a "no failure" credo and decades of innovation in circuit board hardware. A network of certified distributors delivers worldwide, and samples are available so you can evaluate the TP-108 in your application before committing to volume.
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TP 108 Low Profile Test Point: FAQs
Is the TP-108 compatible with the reflow soldering process?
Yes. The standard matte tin version (0.0001" matte tin over 0.0001" nickel underplate) is designed for compatibility with the reflow soldering process, so it integrates into standard SMT workflows without requiring a separate soldering step.
What is the practical difference between the tin and silver finish options?
The primary advantage of the matte tin finish (suffix -T) is that it offers exceptional solderability and high resistivity in a cost effective package. The tin finish will develop a tin oxide layer over time and is well suited for most consumer and industrial applications. Tin finish is not recommended for high mating cycles as the material will wear down quickly compared to the silver finish.
The primary advantage of the silver finish (suffix -S) offers superior electrical conductivity and the lowest contact resistance on offer. The conductivity is exceptionally high (roughly 106% of IACS compared to copper) and is a good choice for multiple spring loaded probe (pogo pin) contacts. The silver plated option requires specialized handling to prevent tarnishing prior to soldering and will develop a silver sulfide layer that remains electrically conductive. Silver finish is more expensive than the tin finish.
Can the TP-108 be specified for medical or aerospace applications?
Yes. Components Corporation's test points are field-proven across medical device, aerospace, and industrial electronics applications. All TP-108 units are manufactured in compliance with Directive 2015/863/EU RoHS and EU Regulation EC 1907/2006, ensuring they meet the material restriction requirements common to regulated industries. Components Corporation can provide a Certificate of Compliance upon request.
