The DIGI-KLIP® SMP/SMA Series, micro-miniature free-standing card edge interconnect system provides the lowest profile and highest density available for the card edge interconnect of two printed circuit boards.

The unique wireform contacts are manufactured from annealed beryllium copper alloy and heat treated after forming for spring temper. The proprietary concept produces free-standing card edge contacts which exhibit superior stress relaxation characteristics, a “wiping action” “gas tight” junction and low contact resistance.

Whether the SMP series (for .031" mating board) or the SMA Series (for .062" mating board) is selected, significant space savings may be achieved. Both contact styles have an above board height of .120" and require mounting holes of only .120" centers.

Choice of adjacent contact spacing is .050" for the SMP050 or SMA050 and .100" for the SMP100 and SMA100 Series. Any combination of single row contacts may be provided from 4 through 50 (SMP050/SMA050) or 4 through 25 (SMP100/SMA100), on convenient, disposable carrier strips.

Although designed for single row application, the contact geometry of the SMP/SMA Series provides dual path potential for further contact integrity.

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This is to certify that Components Corporation designs, manufactures and supplies products to our customers that are in compliance with directive 2002/95/EC. This also pertains to procurement of raw material, component parts and processes.