DIGI-Klip® High Performance Data

Certificate of Compliance with Directive 2002/95/EC RoHS
This is to certify that Components Corporation designs, manufactures and supplies products to our customers that are in compliance with directive 2002/95/EC. This also pertains to procurement of raw material, component parts and processes.

CONTACT STYLE CHOICES
All DIGI-KLIP® free-standing card edge contacts are designed for use in “board-to-board” interconnect applications. There are four series from which to choose, and all of them are provided pre-loaded on disposable injection molded carrier strips for mass mounting, alignment and soldering.

SRP SERIES: standard single row applications; for 0.062" daughter card mating; available in increments of 0.100", 0.150" and 0.156".

DRP SERIES: standard dual row applications; for 0.062" daughter card mating; available in increments of 0.100", 0.150" and 0.156".

SMA SERIES: micro-miniature single row applications; for 0.062" daughter card mating; available in increments of 0.050" and 0.100".

SMP SERIES: micro-miniature single row applications; for 0.031" daughter card mating; available in increments of 0.050" and 0.100"

Performance Specifications for High-Speed Applications
The following parameters are expressed for the SRP series DIGI-KLIP® contact as a typical example of the performance of these products in high speed digital switching environments.

Typical DIGI-KLIP® Contact Styles

Hertzian Stress
This calculation, expressed in thousands of pounds per square inch, has come to be recognized as a more valid predictor of reliability than normal force for demanding interconnect applications. Hertzian stress is a formula which incorporates normal force with such factors as actual contact surface area, mating component geometries and the modulus of elasticity of surface finishes. A minimum Hertzian stress value of 250 Kpsi has been established for prediction of long term reliability in a single contact design.

Performance Values Comparison
Three significant measurements can strongly affect the performance of an interconnect system in today's high speed/low level switching applications. These are: adjacent contact capacitance, inductance and propagation delay (contact rise time). The chart depicted below shows a comparison of these values between an SRP series contact and several other popular card edge contact profiles.